Metal member and manufacturing method therefor

ABSTRACT

The present invention can improve corrosion resistance and fingerprint resistance and can shield electromagnetic waves, as well as imparts a metallic texture to metal materials that is prone to a surface oxidation, such as aluminum, aluminum alloy, titanium, titanium alloy, copper, copper alloy, silver and silver alloy, including magnesium and magnesium alloy through surface treatments such as a protective layer and an fingerprint prevention layer including a passivation layer. The present invention includes a structural pattern formed on one surface of a base layer; a passivation layer formed on the structural pattern; a protective layer formed on the passivation layer; and a passivation layer that faces the protective layer and is formed on the other surface of the base layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation of International Application No. PCT/KR2014/008803 filed on Sep. 23, 2014, which claims priority to Korean Application No. 10-2013-0114272 filed on Sep. 26, 2013, Korean Application 10-2014-0006109 filed on Jan. 17, 2014, and Korean Application 10-2014-0006110 filed on Jan. 17, 2014, which applications are incorporated herein by reference.

TECHNICAL FIELD

The present invention relates to a metal member applied to an outer case, a housing or the like (hereinafter, referred to as a “main body”) of mobile phones, notebook computers and various electronic apparatuses, and more particularly, to a metal member that can improve corrosion resistance and fingerprint resistance and can shield electromagnetic waves, as well as imparts a metallic texture to metal materials that is prone to a surface oxidation, such as magnesium, magnesium alloy, aluminum, aluminum alloy, titanium, titanium alloy, copper, copper alloy, silver and silver alloy (hereinafter, referred to as a “metal”) through surface treatments such as a protective layer and an fingerprint prevention layer including a passivation layer.

BACKGROUND ART

Recently, since magnesium and magnesium alloy material are lightweight, have excellent electromagnetic wave shielding and have excellent heat dissipation, they are widely used over wide fields such as computers, laptop computers, cameras, mobile phones, automobiles and aircraft, including various electronic products and electronic equipment.

However, in order to commercialize a material such as magnesium or magnesium alloy having problems of high oxidation and low corrosion resistance, there is an essential need for another surface treatment to ensure the durability in various internal parts and exterior parts.

Meanwhile, Korean Patent Laid-Open No. 2002-0077150 (Oct. 11, 2002) entitled “magnesium alloy chemical conversion treatment solution, surface treatment method and magnesium alloy substrate” (referred to as a “Document 1”) has already been widely known.

When considering the Document 1 described above, as a means for imparting coating adhesion, corrosion resistance and rust resistance to magnesium alloys, a magnesium alloy chemical conversion solution containing phosphate ions and permanganate ions with pH of 1.5 to 7 and a surface treating method are suggested.

However, in such a conventional method, since the chemical conversion treatment liquid should be preferred in the range from pH 2.0 to 4.0 that is a strong acid treatment conditions, for example, when pH of the chemical conversion treatment solution exceeds 7, an amount of film deposition is extremely low due to the reduction of the oxidizing power of the permanganate ion, the reproduction reliability of the film is degraded, and thus, there are problems in which it is not possible to obtain sufficient corrosion resistance and coating adhesiveness.

SUMMARY

An embodiment of the present invention is directed to provide a metal member that is capable of improving corrosion resistance or the like on a base layer provided as a metal that is prone to a surface oxidation through a surface treatment formed with a passivation layer and a protective layer.

Further, another embodiment of the present invention is directed to form a structural pattern of various shapes on a surface of a base layer to be able to impart metallic texture.

Further, still another embodiment of the present invention is directed to form a fingerprint prevention layer of the base layer in the metal member of the present invention to be able to prevent staining of marks such as a fingerprint or oil of a human body.

Further, still another embodiment of the present invention is directed to a metal member made of a conductive material to be able to shield electromagnetic waves generated from various electronic devices to protect the human body.

According to an aspect of the present invention, as a configuration means of the metal member for solving the problems of the present invention as described above, a structural pattern formed on one surface of the base layer is configured.

Further, the passivation layer formed on the structural pattern and a protective layer formed on the passivation layer as a coated film are constituted.

Moreover, the metal member is configured to include a passivation layer that faces the protective layer and formed on the other surface of the base layer.

As another configuration means of the metal member for solving the problems of the present invention as described above, a structural pattern formed on one surface of the base layer is constituted.

Further, a passivation layer formed on the structural pattern and a protective layer formed on the passivation layer are constituted.

Furthermore, a fingerprint prevention layer formed on the protective layer is constituted.

Moreover, the metal member includes a passivation layer that faces the fingerprint prevention layer and formed on the other surface of the base layer.

As still another configuration means of the metal member for solving the problems of the present invention as described above, a structural pattern formed on one surface of the base layer is constituted.

Furthermore, a passivation layer formed on the structural pattern may be constituted.

Further, a passivation layer that faces the passivation layer and is formed on the other surface of the base layer is constituted.

Further, the metal member is configured to include a protective layer formed on the passivation layer.

Meanwhile, as still another configuration means of the metal member for solving the problems of the present invention as described above, a structural pattern formed on one surface of a base layer is constituted.

Furthermore, a passivation layer formed on the structural pattern is constituted.

Further, a passivation layer that faces the passivation layer and is formed on the other surface of the base layer is constituted.

Moreover, the metal member includes a protective layer formed on the passivation layer and a fingerprint prevention layer formed on the protective layer formed over the structural pattern.

Meanwhile, according to another aspect of the present invention, there is provided a method for manufacturing a metal member that includes a step of forming a structural pattern on a surface of a base layer.

Further, the method further includes a step of forming a passivation layer by a reaction with the passivation solution, in a state of immersing the base layer in a passivation solution heated to a passivation treatment heat temperature.

Further, the method further includes a step of forming a protective layer for protecting the structural pattern on the passivation layer.

Meanwhile, according to still another aspect of the present invention, there is provided a method for manufacturing a metal member that includes a step of forming a structural pattern on a surface of a base layer.

Further, the method further includes a step of forming a passivation layer by a reaction with the passivation solution, in a state of immersing the base layer in a passivation solution heated to a passivation treatment heat temperature.

Further, the method further includes a step of forming a protective layer for protecting the structural pattern over the passivation layer, and a protective layer on the other surface that is not formed with the structural pattern.

Hereinafter, the configuration means of the object of the present invention and various processes will become more obvious through a detailed description of various embodiments illustrated in the accompanying drawings.

It should be understood that different embodiments of the invention, including those described under different aspects of the invention, are meant to be generally applicable to all aspects of the invention. Any embodiment may be combined with any other embodiment unless inappropriate. All examples are illustrative and non-limiting.

Thus, the present invention provides an effect of improving corrosion resistance or the like on a passivation layer provided as a metal prone to a surface oxidation, through a surface treatment formed with a passivation layer and a protective layer.

Further, the present invention provides an effect of enhancing a quality of a design of a product, by forming structural patterns of various shapes on the surface of the base layer to impart a metallic texture.

Further, the present invention provides an effect of always maintaining a clean surface state, by preventing fingerprint or oil of a human body from remaining through the fingerprint prevention layer formed on the base layer.

Further, the present invention provides another advantage of being able to protect the human body from the electromagnetic waves, by shielding the electromagnetic waves generated from various electronic devices, in a case of attaching a conductive metal member to the outer surface of the main body.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram of one embodiment illustrated schematically a state in which a metal member according to the present invention is applied.

FIG. 2 is a diagram schematically illustrating a first embodiment of a structural pattern formed on a surface of the base layer in FIG. 1 according to the present invention.

FIG. 3 is a diagram schematically illustrating a second embodiment of a structural pattern formed on a surface of a base layer in FIG. 1 according to the present invention.

FIG. 4 is a diagram schematically illustrating a third embodiment of a structural pattern formed on a surface of the base layer in FIG. 1 according to the present invention.

FIG. 5 is a diagram schematically illustrating a fourth embodiment of a structural pattern formed on the surface of the base layer in FIG. 1 according to the present invention.

FIG. 6 is a diagram of a first embodiment schematically illustrating a manufacturing process of a metal member according to the present invention.

FIG. 7 is a diagram of a second embodiment schematically illustrating a manufacturing process of the metal member according to the present invention.

FIG. 8 is a diagram of a third embodiment schematically illustrating a manufacturing process of the metal member according to the present invention.

FIG. 9 is a diagram of a fourth embodiment schematically illustrating a manufacturing process of the metal member according to the present invention.

DETAILED DESCRIPTION

Exemplary embodiments of the present invention will be described below in more detail with reference to the accompanying drawings. The present invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. Throughout the disclosure, like reference numerals refer to like parts throughout the various figures and embodiments of the present invention.

In describing specific embodiments of the present invention, the operation and configuration means illustrated by the drawings of the present invention are described as at least one embodiment, and the technical idea of the present invention and its essential configuration means should not be limited thereby.

For reference matter, when adding reference numerals in the drawings described in the present invention, it should be particularly noted that the same constituent elements are denoted by the same reference numerals even if they are added in other drawings.

The present invention will be described in detail below with reference to the attached drawings illustrated in FIGS. 1 to 9.

A metal member 100 according to the present invention is provided to include a metallic material such as aluminum, aluminum alloy, titanium, titanium alloy, copper, copper alloy, silver and silver alloy (hereinafter, referred to as a “metal”), including magnesium, magnesium alloy or the like that is prone to a surface oxidation.

Further, in the present invention, the metal member 100 imparts a metallic texture, improves a corrosion resistance, a salt resistance, a corrosion resistance, a paint adhesion, a fingerprint resistance and the like, and further can shield electromagnetic waves, by forming protective layers 130 and 130 a and a fingerprint prevention layer 140 including passivation layers 120 and 120 a (which is also referred to as a “passivation”) on a base layer 100 a (which is also referred to as a “basic material layer”) provided by various ways such as a die casting, injection, extrusion, rolling, pressing or polishing, by utilizing the aforementioned metal material.

In the present invention, the base layer 100 a is magnesium (Mg) alone or is configured to include at least any one or more selected magnesium alloy among Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, Zn, Zr, Fe, Ca, Li and Be in magnesium (Mg).

Further, in the present invention, the base layer 100 a is aluminum (Al) alone or is configured to include at least any one or more selected aluminum alloys among Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, Zn, Zr, Fe, Ca, Li and Be in aluminum (Al).

Further, in the present invention, the base layer 100 a is copper (Cu) alone or is configured to include at least any one or more selected copper alloys among Mg, Al, Ti, Ag, Ni, Si, Cr, Mn, Zn, Zr, Fe, Ca, Li and Be in copper (Cu).

Further, in the present invention, the base layer 100 a is titanium (Ti) alone or is configured to include at least any one or more selected titanium alloys among Mg, Al, Cu, Ag, Ni, Si, Cr, Mn, Zn, Zr, Fe, Ca, Li and Be in titanium (Ti).

Further, in the present invention, the base layer 100 a is silver (Ag) alone or is configured to include at least any one or more selected silver alloys among Mg, Al, Cu, Ti, Ni, Si, Cr, Mn, Zn, Zr, Fe, Ca Li and Be in silver (Ag).

In addition, in the present invention, a thickness t1 of the base layer 100 a is constituted by 0.02 to 6 mm.

For example, when the thickness t1 of the base layer 100 a is too thin below 0.02 mm, there is also a difficulty in formation of a structural pattern 102 and passivation layers 120 and 120 a to be described below, including a difficulty in a thin film processing through etching or the like. Meanwhile, when the thickness is thicker than 6 mm, although the workability is easy, the weight increases, and this may become a factor that unnecessarily increases a required amount of material.

Accordingly, in the present invention, the thickness t1 is desirably set to approximately 2 mm, depending on the usage purpose and application, including the chemical and physical properties and the workability of the metal material. Furthermore, in the present invention, it is desirable to further include a thinner or thicker thickness in the range of 0.02 to 6 mm.

Meanwhile, as the reliability test conditions of the metal member 100 according to the present invention, since there is need for no deformation or deterioration in a cold thermal shock test performed over 24 cycles from 30 minutes of the temperature −40° C. to 30 minutes of 80° C., and a salt water resistance test performed in salt water of 5% for 48 hours, including a constant-temperature and constant-humidity test performed at a temperature 60° C. and a humidity of 90% for 24 hours, the surface treatment technique is becomes more important than anything.

First, the configuration means of the metal member 100 for solving the problems of the present invention and an embodiment thereof will be specifically described with reference to the accompanying drawings.

As illustrated in attached FIG. 1, the present invention is provided in an external case, a housing (hereinafter, referred to as a “main body”) or the like in mobile phones, notebook computers and various electronic devices, by synthetic resin, urethane, rubber resin or the like. At this time, the metal member 100 is provided through an adhesive layer 150 serving as an attaching means such that the passivation layer 120 a is in contact with the outer surface of the main body 200 described above as illustrated in FIG. 7 or the metal member 100 is provided through an adhesive layer 150 serving as an attaching means such that a protective layer 130 a is in contact with the outer surface as illustrated in appended FIG. 9.

Alternatively, the metal member 100 of the present invention may also be configured so that the passivation layer 120 a or the protective layer 130 a is in contact with the outer surface, by locking means such as a boss, a rib or a hook provided in the main body 200, and it is a matter of course that the main body 200 should not be limited to the aforementioned materials.

Further, as illustrated in attached FIG. 1 and FIGS. 2 to 5, the present invention is characterized by various structural patterns 102 formed on one surface 101 of a base layer 100 a provided on the metal member 100, and the structural pattern 102 means formation and visual expression such as hairline 102 a, a graphic 102 b, an image 102 c and a logo 102 d by physical and chemical means.

For example, the aforementioned structural pattern 102 may be configured to include a hairline 102 a in which mountain sections 102-1 and valley sections 102-2 are successively formed at identical or non-identical periods as illustrated in FIG. 2.

At this time, the hairline 102 a is characterized in that the mountain sections 102-1 and the valley sections 102-2 are formed at the cycles of 10 to 400 within an interval L1 of 1 cm.

That is to say, in the above-mentioned hairline 102 a, when the mountain sections 102-1 and the valley sections 102-2 are formed at 10 cycles or less within the interval L1 of 1 cm, that is, when the number of the mountain sections 102-1 or the valley sections 102-2 is formed by 5 or less, the metallic texture is lowered due to too shapeless interval, and there is a risk of degradation of the design of the product. Meanwhile, when the mountain sections 102-1 and the valley sections 102-2 are formed at 400 cycles or more within the interval L1 of 1 cm, that is, when the number of mountain sections 102-1 or valley sections 102-2 are tightly formed by 200 or more, although the metallic texture, the design and the refinement are excellent, because this case may act as a factor that increases the time and the cost for polishing or machining them, it is desirable to form the mountain sections and the valley sections substantially at the 200 cycles within the interval L1 of 1 cm in consideration of these points. However, it is more desirable to form the mountain sections and the valley sections at the 10 to 400 cycles in the present invention.

Further, as illustrated in FIG. 3, the structural pattern 102 may include a configuration in which one or more FIG. 102b having the identical or non-identical dimensions are formed to be disposed on the surface 101 of the base layer 100 a by combination of concavity 102-3 and concavity 102-4.

For example, the FIG. 102b may includes various kinds of FIG. 102b such as a circular shape, a triangular shape, a square shape, a pentagonal shape, a hexagonal shape and a diamond shape, and naturally should not be limited to the FIG. 102b described above.

At this time, the FIG. 102b is characterized in that four to four hundreds parts of the concavity 102-3 or the convexity 102-4 are formed in 1 cm².

In other words, when forming the above-mentioned concavities 102-3 of four or less, the metallic texture is lowered due to too poor configuration and there is a risk of a decline in design of the product. Meanwhile, when too many concavities 102-3 of four-hundreds or more are too tightly formed, although there are advantages in which the metal texture, the design and the refinement are excellent, because this may act as a factor that increases the time and the cost for polishing or machining them, it is desirable to form approximately two-hundred concavities 200 in consideration of such circumstances. However, it will be more desirable to form the four to four-hundred concavities.

Further, as illustrated in FIG. 4, the structural pattern 102 may include a configuration in which one or more images 102 c are formed to be disposed on the surface 101 of the base layer 100 a by a combination of the concavity 102-3 and the convexity 102-4. For example, in the image 102 c may include insects such as butterflies and bees, including plants, such as flowers, leaves and trees, and may also include animals such as dogs and pigs, persons, portraits or the like. Of course, it should not be limited to the images 102 c listed above.

Further, the structural pattern 102 may include a configuration in which one or more logos 102 d are formed to be disposed on a surface 101 of the base layer 100 a by a combination of concavity 102-3 and convexity 102-4 as illustrated in FIG. 5.

For example, in the above-mentioned logo 102 d includes a group name, a school name, an academy name, a shop name, a group name, a local autonomy organization name or the like, and may also include a person's name or a business card, which should also not be limited to the logos 102 d listed above.

Meanwhile, in the present invention, as illustrated in FIG. 2, the structural pattern 102 may include a configuration in which any one selected among the FIG. 102-3, the image 102 c or the logo 102 d is formed by a combination of the concavity 102-3 and the convexity 102-4 on the base of the hairline 102 a described above, or at least two or more are selected among the FIG. 102-3, the image 102 c or the logo 102 d and are formed by a combination of the concavity 102-3 and the convexity 102-4, as a means for further utilizing the metallic texture and the design.

At this time, it would be desirable to differentiate the structural pattern 102 from the hairline 102 a by the configuration in which the FIG. 102b , the image 102 c and the logo 102 d are formed to protrude at a height of 0.01 to 0.6 mm from the surface 101 of the base layer 102 a formed with the hairline 100 a.

Furthermore, it would be desirable to perform a mirror treatment or a hatching treatment of the surface (not illustrated) of the FIG. 102b , the image 102 c and the logo 102 d formed to protrude, thereby differentiating from the hairline 102 a and providing the better visual feeling.

For example, when the protruding height of the FIG. 102b , the image 102 c and the logo 102 d is formed to 0.01 mm or less, because there is no clear differentiation in comparison with the hairline 102 a formed the basic foundation, there is a risk of dropping the visual feeling. Meanwhile, when the too high protruding height of 0.6 mm or more is formed, although the effect of the visual differentiation is excellent in comparison with the hairline 102 a, because there is a risk of damage of the surface 101 of the base layer 100 a due to the intense protrusion, it would be desirable to form the protruding height of 0.01 to 0.6 mm in consideration such a circumstance in the present invention.

Further, it will be obvious that the concavity 102-3 and the convexity 102-4 included in the aforementioned structural pattern 102 may be expressed or formed by intaglio and emboss in the present invention.

In addition, in the present invention, a depth D1 of the structural pattern 102 listed above is formed by 0.01 to 20 μm from the surface 100 a of the base layer 101, as illustrated in FIGS. 6 to 9.

At this time, when the depth D1 of the structural pattern 102 is shallowly formed below 0.01 μm, it is very difficult to distinguish with the naked eye, i.e., visually, there is a risk of rather lowering the metallic texture. Meanwhile, when the depth is formed deeply above 20 μm, because there is a risk of damaging the base layer 100 a of the metal member 100, it would be desirable to form the depth D1 of 0.01 to 20 μm in consideration such a circumstance in the present invention.

The present invention configured as described above has a configuration in which, as illustrated in FIGS. 6 and 7, the passivation layer 120 is formed in the structural pattern 102 and the protective layer 130 is formed on the passivation layer 120 as a coated film.

In the present invention, the protective layer 130 is protected to prevent the structural pattern 102 from being damaged and is uniformly formed as the coated film having a thickness of 0.2 to 20 μm to improve the corrosion resistance of the base layer 100 a that is formed with the passivation layer 120.

At this time, when the thickness of the protective layer 130 is formed below 0.2 μm, because a fine structural pattern 102 can be provided, although there is an advantage that facilitates the metallic texture, because the thickness of the coated film is too thin, there is a risk of a decline in the protection properties. Meanwhile, when the thickness is thickly formed above 20 μm, although the protection properties and the corrosion resistance are excellent, the fine structural pattern 102 may not be provided, and there may be a risk of a decline in the metal texture of the fine structural pattern 102 by mutual interference of reflected light from the outside.

Therefore, it would be desirable to properly select and form the thickness of the protective layer 130 not to be too thin or thick within the range of 0.2 to 20 μm, depending on the using purpose and applications, including the chemical and physical characteristics of the base layer 100 a, i.e., the metal material.

Further, the present invention includes a configuration in which a passivation layer 120 a provided at the bottom of the base layer 100 a to face the protective layer 130, that is, on the other surface 101 a on which the structural pattern 102 is not formed.

Furthermore, the present invention has a configuration in which a fingerprint prevention layer 140 to be described later is forming on the protective layer 130 to a thickness of 0.01 to 2 μm.

Further, the present invention has a configuration in which a passivation layer 120 a is formed on the other surface 100 a of the base layer 101 a to face the above-mentioned fingerprint prevention layer 140.

In the present invention, the passivation layers 120 and 120 a are formed on the surfaces 101 and 101 a of the base layer 100 a by the reaction with passivation solution 110, in a state in which the passivation solution 110 to be described later is filled in the solution tank 300 as illustrated in (c) of FIGS. 6 and 7 and the base layer 100 a is immersed (also referred to as “dipping”) in the passivation solution 110 that is heated (also referred to as “heating”) to a passivation treatment heat temperature T1 by a separate heating means such as a heater. At this time, the thicknesses of the passivation layers 120 and 120 a are formed in the range of 0.001 to 10 μm corresponding to 0.005 to 0.5 times the thickness of the protective layer 130.

For example, when the thickness of the passivation layers 120 and 120 a are thinly formed below 0.001 μm, because a damage of the fine structural pattern 102 is small, there is an advantages that facilitates the metallic texture. However, because the oxide coating (also referred to as an “oxide film”) is formed too thin, there is a risk of a decline in the corrosion resistance. Meanwhile, when the thickness is thickly formed above 10 μm, although the corrosion resistance is excellent, there may be a risk of a damage of the fine structural pattern 102.

Accordingly, in the present invention, although the thicknesses of the passivation layers 120 and 120 a may vary depending on the passivation treatment heat temperature T1, the type of the passivation solution 110 to be described below, i.e., a reactive substance and the immersion time, including the material of the base layer 100 a, e.g., the metal material, it would be desirable to form the thickness to 0.001 to 10 μm in the present invention.

Furthermore, the present invention has a configuration in which an adhesive layer 150 having adhesiveness is formed on the passivation layer 120 a that is not formed with the structural pattern 102 as illustrated in FIG. 7, and the adhesive layer 150 is attached to the outer surface of the main body 200.

Meanwhile, the present invention has a configuration in which, as illustrated in FIG. 6, the metal member 100 is provided via an adhesive layer 150 serving as an attaching means so that the protective layer 130 a is in contact with the outer surface of the main body 200, and the structural pattern 102 is formed on one surface 101 of the base layer 100 a.

Alternatively, the metal member 100 of the present invention may be configured so that the protective layer 130 a is in contact with the outer surface of the main body 200 by a locking means such as a boss, a rib and a hook provided in the main body 200.

Further, the present invention has a configuration that forms a passivation layer 120 formed on the structural pattern 102, and a passivation layer 120 a is also formed on the other surface 101 a provided on the lower portion of the base layer 100 a to face the passivation layer 120.

At this time, the pattern structure 102 is not formed on the surface 101 a.

Further, the present invention has a configuration in which protective layers 130 and 130 a formed as the coated film are formed on the passivation layers 120 and 120 a.

In the present invention, the protective layers 130 and 130 a have a configuration that is uniformly formed as the coated film having a thickness of 0.2 to 20 μm as described above so as to protect the structural pattern 102 from being damaged and improve the corrosion resistance of the base layer 100 a formed with the passivation layers 120 and 120 a.

Furthermore, the present invention has a configuration in which a fingerprint prevention layer 140 described later is formed on the protective layer 130, i.e., the protective layer 130 formed on the structural pattern 102 to the thickness of 0.01 to 2 μm.

Further, the thicknesses of the passivation layers 120 and 120 a are formed to 0.001 to 10 μm corresponding to 0.005 to 0.5 times the thickness of the protective layers 130 and 130 a as described above.

Meanwhile, as illustrated in (c) of FIGS. 8 and 9 c, in the present invention, the passivation layers 120 and 120 a are formed on the surfaces 101 and 101 a of the base layer 100 by the reaction with the passivation solution 110 in a state in which a solution tank 300 filled with the passivation solution 110 to be described later is provided, and the base layer 100 a is immersed in the passivation solution 110 that is heated (also referred to as “heating”) to the passivation treatment heat temperature T1 by another heating means such as a heater.

In addition, as illustrated in FIG. 6, the present invention has a configuration in which adhesive layer 150 having adhesiveness is formed on the protective layer 130 a that is not formed with the structural pattern 102 and adheres to the outer surface of the main body 200.

At this time, the adhesive layer 150 is formed by applying an adhesive formed by selecting at least one or two or more of silicone-based adhesive, acryl-based adhesive, urethane-based adhesive, synthetic resin-based adhesive, fluorine resin-based adhesive, epoxy-based adhesive or PET-based adhesive.

Further, as other means, the adhesive layer 150 is formed to include a double-sided tape selected by at least any one among polyamide-based adhesive, polyimide-based adhesive, silicone-based adhesive, fluorine resin-based adhesive, epoxy-based adhesive, urethane-based adhesive, PET-based adhesive, acrylic adhesive and synthetic resin-based adhesive.

Hereinafter, the manufacturing process of the metal member 100 and its embodiments for solving the problems of the present invention will be specifically described with reference to the accompanying drawings.

First, as illustrated in FIG. 6, the method includes a step of forming a structural pattern 102 on the surface 101 of the base layer 100 a made of a metal material as described above.

Further, the method includes a step of forming passivation layers 120 and 120 a by reaction with the passivation solution 110 in a state of immersing the base layer 100 a into the passivation solution 110 heated to a passivation treatment heat temperature T1.

In the present invention, as illustrated in (c) of FIG. 6, the passivation layers 120 and 120 a are formed on the surface 101 of the base layer 100 a by the reaction with the passivation solution 110, in a state in which the passivation solution 110 is filled in the solution chamber 300 and the base layer 100 a is immersed in the passivation solution 110 that is heated (also referred to as “heating”) to the passivation treatment heat temperature T1 by a separate heating means such as a heater.

Also, the method includes a step of forming the protective layer 130 on the passivation layer 120 by a coating treatment to protect the structural pattern 102 as already described above.

In the present invention, the protective layer 130 is formed by a transparent resin or a color resin, and is formed by a coating treatment, using at least one of an electrodeposition coating method, a synthetic resin coating method, a powder coating method, and an electrostatic coating method.

Further, the method includes a step of forming a fingerprint prevention layer 140 on the protective layer 130.

In the present invention, the fingerprint prevention layer 140 is formed by being coated by the heat treatment for 15 minutes at the heat temperature of 40 to 120° C. after absorbing the fingerprint prevention solution (not illustrated) to the protective layer 130 (also called as a “contact”), and by forming its thickness to 0.01 to 2 μm.

Further, the above-described fingerprint prevention solution would be desirably adsorbed by adsorption means such as injection of the mixed composition of fluorine solvent and volatile solvent at the weight ratio of 1 to 3; 7 to 9 onto the surface of the protective layer 130, or immersion of the mixed composition into the fingerprint prevention solution (also called as “dipping”).

At this time, since the fingerprint prevention liquid contains a volatile substance, although it is also possible to naturally dry the heat treatment means, it would be more desirable to dry the heat treatment means by infrared or hot air.

In addition, when the weight ratio of the fluorine solvent is set too low below 1 in the fingerprint prevention solution, it is feared that the thickness of the fingerprint prevention layer 140 may be coated too low below 0.01 μm by the fluorine solvent remaining after the removal of the volatile solvent by thermal treatment. Meanwhile, when the weight ratio of the fluorine solvent is set too high above 3, the thickness of the fingerprint prevention layer 140 is too thickly coated above 2 μm, it is feared that the removal of the fingerprints of oil or the like of the human body may become difficult, and it is feared that reflected light of the light from the outside interfere with each other, thereby reducing the metal texture of the fine structural pattern 102. Thus, it would be desirable to uniformly form the fingerprint prevention liquid at a thickness of 0.01 to 2 μm in consideration of such a circumstance.

Further, when the heat temperature for the heat treatment is set below 40 μm, it is feared that the coating treatment of the volatile solvent is not normally performed, and finally the fingerprint prevention layer 140 may be easily peeled off. Meanwhile, when the heat temperature is set too high above 120° C., drying of the volatile solvent proceeds too fast, and the peeling phenomenon of the fingerprint prevention layer 140 may occur. Thus, it would be desirable to select the appropriate heat treatment temperature within the range of 40 to 120° C. in consideration of such a circumstance.

Further, even when the heat treatment time of the heat temperature is set to be short below 1 minute, the coating treatment of the volatile solvent is not normally performed, it is feared that the fingerprint prevention layer 140 is easily peeled off. Meanwhile, when the heat treatment time is set too long above 15 minutes, although there is an advantage capable of obtaining a perfect fingerprint prevention layer 140, the process time for the heat treatment becomes unnecessarily longer, which may act as an economically wasteful factor. Thus, it would be desirable to select the appropriate time within the range of 1 to 15 minutes.

Meanwhile, in the present invention, the fingerprint prevention layer 140 is coated at a thickness of 0.01 to 2 pin using a polymer or oligomer resin. When the thickness of the fingerprint prevention layer 140 is too thinly coated below 0.01 μm, there is a risk of being easily peeled off or damaged. Meanwhile, when the thickness of the fingerprint prevention layer 140 is too thickly coated over 2 μm, there is a risk of a difficulty of the removal the fingerprint or body oil, and it is feared that the reflected light of light from the outside interfere with each other to decrease the metal texture of the fine structural pattern 10. Thus, it would be desirable to uniformly form a thickness of 0.01 to 2 μm in consideration such a circumstance so that the thickness is not too thin or too thick.

Further, in the present invention, the fingerprint prevention layer 140 may be formed to include a polymeric film. At this time, the polymer film is formed at the thickness of 0.01 to 2 μm by the adhesive layer (not illustrated) having adhesiveness as d3escribed above. When the polymer film is formed too thin below 0.01 μm, there is a risk of being easily peeled off or damaged. Meanwhile, when the polymer film is formed too tick above 2 μm, there is a risk of a difficulty of the removal the fingerprint or body oil, and it is feared that the reflected light of light from the outside interfere with each other to decrease the metal texture of the fine structural pattern 10. Thus, it would be desirable to uniformly form a thickness of 0.01 to 2 μm in consideration such a circumstance so that the thickness is not too thin or too thick.

In addition, in the present invention, it would be desirable to transparently form the fingerprint prevention layer 140 to further noticeably provide the metal texture of the finely formed structural pattern 102.

Hereinafter, other manufacturing processes of the metal member 100 for solving the problems according to the present invention and its embodiment will be specifically described with reference to the accompanying drawings.

First, as illustrated in FIG. 7, the method includes a step of forming a structural pattern 102 on the surface 101 of the base layer 100 a made of a metal material.

Further, the method includes a step of forming passivation layers 120 and 120 a by the reaction with the passivation solution 110 in a state of being immersing the base layer 100 a into the passivation solution 110 heated to a passivation treatment heat temperature T1.

Further, the method includes a step of forming the protective layer 130 for protecting the structural pattern 102 over the passivation layer 120.

At this time, the protective layer 130 is formed by a transparent resin or a color resin, and is formed by a coating treatment, using at least one of an electrodeposition coating method, a synthetic resin coating method, a powder coating method, and an electrostatic coating method.

Further, the method includes a step of attaching the base layer to the outer surface of the main body 200 through the adhesive layer 150, after forming the adhesive layer 150 having adhesiveness over another passivation layer 120 a that faces the protective layer 130 and is not formed with the structural pattern 102.

Meanwhile, in the present invention, as illustrated in (c) of FIG. 7, the passivation layers 120 and 120 a are formed on the surfaces 101 and 101 a of the base layer 100 by the reaction with the passivation solution 110 in a state in which a solution tank 300 is filled with the passivation solution 110, and the base layer 100 a is immersed in the passivation solution 110 that is heated (also referred to as “heating”) to the passivation treatment heat temperature T1 by another heating means such as a heater.

In addition, the adhesive layer 150 is formed by applying an adhesive formed by selecting at least one or two or more of silicone-based adhesive, acryl-based adhesive, urethane-based adhesive, synthetic resin-based adhesive, fluorine resin-based adhesive, epoxy-based adhesive or PET-based adhesive.

Further, as other means, the adhesive layer 150 may be formed to include a double-sided tape selected by at least any one among polyamide-based adhesive, polyimide-based adhesive, silicone-based adhesive, fluorine resin-based adhesive, epoxy-based adhesive, urethane-based adhesive, PET-based adhesive, acrylic adhesive and synthetic resin-based adhesive.

At this time, the thickness of the adhesive layer 150 is formed by 0.02 to 0.2 mm. For example, when the thickness of the adhesive layer 150 is thinly set below 0.02 mm, the adhesiveness is weak, and it is feared that the metal member 100 is easily peeled off from the outer surface of the main body 200. Meanwhile, when the thickness is thickly set above 0.2 mm, although the adhesiveness is strong, because the overall thickness including the main body 200 becomes thicker, this may become drawbacks to thinning of the product. It will be desirable to select the appropriate thickness, depending on the product, the object and the application to which the metal member 100 of the present invention is applied.

Hereinafter, still another manufacturing process of the metal member 100 for solving the problems according to the present invention and its embodiment will be specifically described with reference to the accompanying drawings.

First, as illustrated in FIG. 6, the method includes a step of forming a structural pattern 102 on the surface 101 of the base layer 100 a made of a metal material.

Further, the method includes a step of forming passivation layers 120 and 120 a by reaction with the passivation solution 110 in a state of immersing the base layer 100 a into the passivation solution 110 heated to a passivation treatment heat temperature T.

Further, the method includes a step of forming the protective layer 130 for protecting the structural pattern 102 over the passivation layer 120.

Further, the method includes a step of forming the aforementioned fingerprint prevention layer 140 over the protective layer 130.

Further, the method includes a step of forming a protective layer 130 a over a passivation layer 120 a of the other surface 101 a that faces the protective layer 130 and is not formed with the structural pattern 102.

Meanwhile, in the present invention, as illustrated in (c) of FIG. 6, the passivation layers 120 and 120 a are formed on the surfaces 101 and 101 a of the base layer 100 by the reaction with the passivation solution 110 in a state in which a solution tank 300 is filled with the passivation solution 110, and the base layer 100 a is immersed in the passivation solution 110 that is heated (also referred to as “heating”) to the passivation treatment heat temperature T1 by another heating means such as a heater.

Further, the method includes a step of attaching the base layer to the outer surface of the main body 200 through the adhesive layer 150, after forming the adhesive layer 150 having adhesiveness over the protective layer 130 a.

Here, the protective layers 130 and 130 a are formed by a transparent resin or a color resin, and are formed by a coating treatment, using at least one of an electrodeposition coating method, a synthetic resin coating method, a powder coating method, and an electrostatic coating method.

Hereinafter, various embodiments that can be included in the present invention including the manufacturing processes as described above will be described in more detail.

First, in the present invention, as illustrated in FIG. 2-1, the structural pattern 102 may be configured to include hairlines 102 a in which mountain sections 102-1 and valley sections 102-2 are successively formed at identical or non-identical periods.

At this time, the hairline 102 a is characterized in that the mountain sections 102-1 and the valley sections 102-2 are formed at the cycles of 10 to 400 within an interval L1 of 1 cm.

Further, in the present invention, as illustrated in FIG. 2-2, the structural pattern 102 may include a configuration in which FIG. 102b having the identical or non-identical dimensions are formed by a combination of concavity 102-3 and concavity 102-4.

At this time, the FIG. 102b is characterized in that four to four hundreds parts of the concavity 102-3 or the convexity 102-4 are formed in 1 cm².

Further, in the present invention, as illustrated in FIG. 2-3, the structural pattern 102 may be configured to an image 102 c formed by a combination of the concavity 102-3 and the convexity 102-4.

Further, in the present invention, in the present invention, as illustrated in FIG. 2-4, the structural pattern 102 may be configured to a log 102 d formed by a combination of the concavity 102-3 and the convexity 102-4.

In addition, in the present invention, the aforementioned structural pattern 102 has a configuration in which its depth D1 is formed to 0.01 to 20 μm by at least any one selected from laser machining, cutting, grinding, corrosion machining and sandblasting.

Meanwhile, in the present invention, the passivation solution 110 contained in the means for forming the passivation layers 120 and 120 a on the surfaces 101 and 101 a of the base layer 100 a, i.e., the reactants for forming the oxide film is formed to include volatile alcohol obtained by mixing at least two or more selected from ethanol, methanol, isopropyl alcohol, butyl alcohol and octyl alcohol.

Further, the passivation solution 110 may be formed to include volatile keton-based substance obtained by mixing at least any one or two or more selected from acetone, methyl ethyl ketone and methyl isobutyl ketone.

Meanwhile, in the present invention, in regards to the passivation treatment heat temperature T1 contained in the means for forming the passivation layers 120 and 120 a on the surfaces 101 and 101 a of the base layer 100 a, by heating the passivation solution 110 of the alcohol-based substance or the ketone-based substance filled in the solution tank 300 in the range from 40° C. to the boiling point, it would be desirable to facilitate the reaction for the formation of the passivation layers 120 and 120 a accordingly.

Further, in regards to the passivation treatment heat temperature T1, by heating the passivation solution 110 of the alcohol-based substance or the ketone-based substance filled in the solution tank 300 in the range from 40 to 220° C., it would be desirable to facilitate the reaction for the formation of the passivation layers 120 and 120 a.

For example, when the passivation treatment heat temperature T1 is set below 40° C., the reaction of the passivation solution 110 is lowered, and there is a risk of failure in dense formation of the passivation layers 120 and 120 a on the surfaces 101 and 101 a of the base layer. Meanwhile, when the passivation treatment heat temperature T1 is set above the boiling point and 220° C., because evaporation of the passivation solution 110 formed of the alcohol-based or ketone-based substance is severe and a loss occurs, this case is economically disadvantageous. Furthermore, because there is a risk of a failure in formation of the uniform passivation layers 120 and 120 a, it would be more desirable to select the appropriate passivation treatment heat temperature T1 within the range from 40° C. to the boiling point or within the range from 40 to 220° C. in consideration of the passivation solution 110 to be creased

That is to say, when examining its boiling point in the alcohol reactant contained in the passivation solution 110, ethanol is 8.3° C., methanol is 64.65° C., isopropyl alcohol is 82° C., butyl alcohol is 117.7° C., and octyl alcohol is 194.5° C. Meanwhile, when examining the boiling point in the ketone-based reactant contained in the passivation solution 110, acetone is 56.5° C., methyl ethyl ketone is 79.6° C. and methyl isobutyl ketone is 115.9° C. Thus, in the present invention, it would be more desirable to create by selecting one of them alone or appropriately select the passivation treatment heat temperature T1 within the range from 40° C. to the boiling point or within the range from 40 to 220° C., depending on the type of reactants created by a combination of two or more substances.

Furthermore, in the present invention, although the time of immersing the base layer 100 a in the passivation solution 110 contained in the means for forming the passivation layers 120 and 120 a on the surfaces 101 and 101 a of the base layer 100 a, e.g., heated to the passivation treatment heat temperature T1 may vary depending on the types of the aforementioned alcohol-based or ketone-based reactant contained in the passivation solution 110, it is more desirable to immerse the base layer within the range from one second to 30 minutes.

For example, when the immersion time is too shortly set below one second, the reaction of the passivation solution 110 is lowered, and there is a risk of a failure of a dense formation of the passivation layers 120 and 120 a on the surfaces 101 and 101 a of the base layer 100 a. Meanwhile, when the immersion time is set to be long over 30 minutes, although there is an advantage in which the compactness of the passivation layers 120 and 120 a is enhanced, the process time for the passivation layers 120 and 120 a, i.e., the passivation treatment becomes unnecessarily longer which may act as an economical waste factor. Thus, it is more desirable to suitably select the immersion time within the range from 1 second to 30 minutes in the present invention.

In this way, although the thicknesses of the passivation layers 120 and 120 a formed on the surfaces 101 and 101 a of the base layer 100 a may vary depending on the type and the immersion time of the passivation solution 110, i.e., the reactants, including the passivation treatment heat temperature T1 heated in the solution tank 300, it is desirable to form the thickness in the range from 0.001 to 10 μm.

For example, when the thicknesses of the passivation layers 120 and 120 a are thinly formed below 0.001 μm, damage to the fine structural pattern 102 is small, and there is an advantage of facilitating the metallic texture. However, because the oxide coating (also referred to as an “oxide film”) is formed too thin, there is a risk of a decline in the corrosion resistance. Meanwhile, when the thickness is thickly formed above 10 μm, although the corrosion resistance is excellent, there may be a risk of a damage of the fine structural pattern 102.

Thus formed passivation layers 120 and 120 a have the effect that enhances the suction force of the coated film at the time of forming the protective layers 130 and 130 a on the basis of the coating with an improvement in the corrosion resistance, and thus, the metal texture is further improved, including corrosion resistance rust resistance in the metal member 100 of the present invention.

Meanwhile, the present invention would be desirable to sufficiently remove the foreign matters adhered to the surfaces 101 and 101 a via a sufficient degreasing process and a washing process, before immersing the aforementioned base layer 100 a in the solution tank 300 a filled with the passivation solution 110.

That is to say, when the foreign matters adhere to the surfaces 101 and 101 a of the base layer 100 a, because the passivation solution 110 does not entirely uniformly adhere by a surface tension, finally, it may give a bad influence on the formation of the passivation layers 120 and 120 a.

Subsequently, after forming the passivation layers 120 and 120 a, a step of drying the base layer 100 a may be further included.

For example, because the passivation solution 110 is a volatile substance, it is also possible to naturally dry the passivation solution 110 at room temperature. However, it would be more desirable to dry the passivation solution 110 by an infrared or hot air performed at the heat temperature in the range of 20 to 60° C. or to dry the passivation solution 110 by ultrasound.

It will be obvious to those skilled in the art that various changes and modifications may be made without departing from the technical idea of the present invention.

Accordingly, the technical scope of the present invention will be desirably defined by the claims of the present invention, rather than being limited to the contents described in various embodiments as described.

While the present invention has been described with respect to the specific embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. 

1. A metal member (100) comprising: a structural pattern (102) formed on one surface (101) of a base layer (100 a); a passivation layer (120) formed on the structural pattern (102); a protective layer (130) formed as a coated film having a thickness of 0.2 to 20 μm to protect the structural pattern (102) formed with the passivation layer (120); and a passivation layer (120 a) formed on the other surface (101 a) of the base layer 100 a that faces the protective layer (130).
 2. The metal member system of claim 1, further comprising: a protective layer (130 a) formed as a coated film having a thickness of 0.2 to 20 μm over the passivation layer (120 a).
 3. The metal member system of claim 1, wherein the passivation layers (120 and 120 a) are formed by a reaction with a passivation solution (110), in a state of immersing the base layer (100 a) to an Alcohol-based passivation solution (110) heated to a passivation treatment heat temperature (T1) in a range of 1 second to 30 minutes, and the passivation treatment heat temperature (T1) is obtained by heating the passivation solution (110) in a range of 40° C. to a boiling point or in a range of 40° C. to 220° C.
 4. The metal member system of claim 3, wherein the passivation solution (110) is a substance obtained by mixing at least two or more selected from ethanol, methanol, isopropyl alcohol, butyl alcohol and octyl alcohol.
 5. The metal member system of claim 3, wherein the passivation layers (120 and 120 a) are formed by the reaction with the passivation solution (110) in a state of immersing the base layer (100 a) to the ketone-based passivation solution (110) heated to the passivation treatment heat temperature (T1) in a range of 1 second to 30 minutes, and the passivation treatment heat temperature (T1) is obtained by heating the passivation solution (110) in a range of 40° C. to a boiling point or in a range of 40° C. to 220° C.
 6. The metal member system of claim 5, wherein the passivation solution (110) is a substance obtained by a mixture of any one or two or more selected from acetone, methyl ethyl ketone and methyl isobutyl ketone.
 7. The metal member system of claim 1, wherein the thickness of the passivation layers (120 and 120 a) is 0.005 to 0.5 times the thickness of the protective layer (130).
 8. The metal member system of claim 1, wherein a fingerprint prevention layer (140) is formed over the protective layer 130 by heat treatment for 1 to 30 minutes at a heat temperature of 40 to 120° C. after a fingerprint prevention solution obtained by mixing fluorine solvent and volatile solvent in a weight ratio of 1 to 3:7 to 9 is adsorbed onto the protective layer
 130. 9. A method for manufacturing a metal member, the method comprising: forming a structural pattern (102) on one surface (101) of a base layer (100 a); forming passivation layers (120 and 120 a) by a reaction with a passivation solution (110) in a state of immersing the base layer (100 a) to Alcohol-based or ketone-based passivation solution (110) that is heated to a passivation treatment heat temperature (T1) in a range of 40° C. to a boiling point or in a range of 40° C. to 220° C. for 1 second to 30 minute; and forming a protective layer (130) for protecting the structural pattern (102) on the passivation layer (120).
 10. The method of claim 9, further comprising: forming a protective layer (130 a) over the passivation layer (120 a) of the other surface (101 a) on which the structural pattern (102) is not formed.
 11. The method of claim 9, wherein the passivation solution (110) is a substance obtained by mixing at least two or more selected from ethanol, methanol, isopropyl alcohol, butyl alcohol and octyl alcohol.
 12. The method of claim 9, wherein the passivation solution (110) is a substance obtained by a mixture of any one or two or more selected from acetone, methyl ethyl ketone and methyl isobutyl ketone.
 13. A method for manufacturing a metal member, the method comprising: forming a structural pattern (102) on one surface (101) of a base layer (100 a) made of magnesium or magnesium alloy; forming passivation layers (120 and 120 a) by a reaction with a passivation solution (110) in a state of immersing the base layer (100 a) to Alcohol-based or ketone-based passivation solution (110) that is heated to a passivation treatment heat temperature (T1); and forming a coated protective layer (130) for protecting the structural pattern (102) formed with the passivation layer (120).
 14. The method of claim 13, further comprising: forming a coated protective layer (130 a) over the passivation layer (120 a) of the other surface (101 a) on which the structural pattern (102) is not formed.
 15. The method of claim 13, wherein the passivation solution (110) is a substance obtained by mixing at least two or more selected from ethanol, methanol, isopropyl alcohol, butyl alcohol and octyl alcohol.
 16. The method of claim 13, wherein the passivation solution (110) is a substance obtained by a mixture of any one or two or more selected from acetone, methyl ethyl ketone and methyl isobutyl ketone.
 17. The method of claim 13, wherein the time of immersing the base layer (100 a) in the passivation solution (110) is in a range of 1 second to 30 minutes.
 18. The method of claim 13, wherein the passivation treatment heat temperature (T1) is obtained by heating the passivation solution (110) in a range of 40° C. to a boiling point or in a range of 40° C. to 220° C. 